Seligman Ventures Leads Cognichip’s $60M Series A to Back Physics-Informed AI for Chip Design, Intel CEO Lip-Bu Tan and Seligman Ventures’ Umesh Padval Join the Board
Cognichip, the company pioneering ACI® – Artificial Chip Intelligence – for semiconductor design, today announced an oversubscribed $60 million Series A financing led by Seligman Ventures, with participation from SBI Investment and additional semiconductor-focused investors. All seed investors, including Mayfield, Lux Capital, FPV, and Candou Ventures, participated above pro rata allocations, bringing the company’s total funding to $93 million. As part of the financing, Umesh Padval, Managing Partner at Seligman Ventures and former semiconductor company CEO, has joined Cognichip’s Board of Directors. Lip-Bu Tan, CEO of Intel, who also participated in the round, joins Cognichip’s Board of Directors.
Cognichip Launches out of Stealth with $33M in Seed Funding to Deliver Artificial Chip Intelligence – ACI®
Cognichip, the company pioneering Artificial Chip Intelligence (ACI®) to power the future of semiconductor design, today announced its launch out of stealth with $33 million in seed funding. Led by Lux Capital and Mayfield, with support from FPV and Candou Ventures, Cognichip is pioneering the first physics-informed foundational model (PIFM) for semiconductors, designed to drastically accelerate development timelines, reduce costs, and enable the next wave of AI innovation.
