Articles from TeraSignal

ECOC 2026 — TeraSignal, a leader in intelligent connectivity for AI infrastructure, today announced that it will demonstrate CMIS Link Training (CMIS-LT) with Keysight Technologies as part of the OIF interoperability demonstrations at ECOC 2026 in Málaga, Spain. The live demonstration at the OIF booth will showcase CMIS-LT operating on a 200G/lane high-speed link, illustrating how link training helps coordinate electrical interface settings between interoperable devices for next-generation 1.6T AI connectivity.

ECOC 2026 — TeraSignal, a leader in intelligent connectivity for AI infrastructure, today introduced AWP (Analog Wave Processor), a new high-speed signal-processing architecture that performs mathematical operations directly on broadband electrical waveforms.

OFC 2026 – TeraSignal, a leader in intelligent interconnect technology today announced the TeraSignal TS5802, the world’s most advanced analog equalizer, implemented in advanced CMOS technology and engineered to extend reach and increase link margin for 200G and higher-speed interconnects. The TS5802 is built on TeraSignal’s proprietary TSAFE™ (TeraSignal Analog Front-End) technology, which tightly integrates the critical high-speed analog building blocks required for next-generation linear interconnects in AI scale up networks.

OFC 2026 -- TeraSignal, a leader in intelligent interconnect technology, today announced that its TS9802 Intelligent TIA with TSLink™ Digital Eye Monitoring has been recognized with a 4.0 rating in the 2026 Lightwave + BTR Innovation Reviews in the Communications Semiconductors and Electrical ICs category. The prestigious program evaluates the most innovative technologies shaping the future of optical networking, data centers, and high-performance computing.

OFC 2026 – TeraSignal, a leader in intelligent interconnect technology, today announced that it will demonstrate CMIS-based link training for linear optics and copper interconnects at OFC 2026, showcasing a major advancement in the deployment of next-generation linear interfaces for optical and copper interconnects. The demonstration incorporates TeraSignal’s TSLink™ link training algorithm directly within the Common Management Interface Specification (CMIS) framework, enabling automatic configuration and optimization of each link to maximize signal-to-noise ratio (SNR) and link margin.